American Semiconductor, Inc.

Overview

American Semiconductor, Inc.: Revolutionizing the Semiconductor Industry with Ultra-Thin Chip Technology

When it comes to innovation and cutting-edge technology, American Semiconductor, Inc. stands at the forefront of the semiconductor and related industries. As the leading developer and manufacturer of ultra-thin chip technology and manufacturing, this company has revolutionized the way we think about electronic devices. From their state-of-the-art facility in Boise, Idaho, American Semiconductor is changing the game with their Semiconductor-on-Polymer (SoP) wafer level chip scale packaging (WLCSP) for thin device applications.

Founded in 2001, American Semiconductor started as a CMOS process technology development company specializing in CMOS fabrication and IC design for high altitude electronics. However, in 2012, the company made a strategic pivot to focus on the commercialization of ultra-thin device fabrication using their groundbreaking Semiconductor-on-Polymer™ advanced packaging technology. This shift in focus has propelled American Semiconductor to the forefront of the industry, making them a pioneer in thin device technology.

At the heart of American Semiconductor's success lies their Semiconductor-on-Polymer (SoP) wafer level chip scale packaging (WLCSP). This innovative technology allows for the creation of ultra-thin chips that can be used in a wide range of applications, including chip-on-flex, protected fan-in, heterogeneous integration, and multi-chip packaging. By providing design, assembly, test, and custom engineering services for thin-device technology, American Semiconductor has become a one-stop solution for companies looking to incorporate thin electronics into their products.

One of the key benefits of working at American Semiconductor is the opportunity to be at the forefront of technological advancements. Employees have the chance to work with cutting-edge technology and contribute to the development of new and exciting products. Whether it's designing new chip-on-flex applications or pushing the boundaries of multi-chip packaging, American Semiconductor offers its employees the chance to make a real impact in the industry.

Additionally, American Semiconductor's commitment to research and development ensures that employees are constantly challenged and engaged. The company invests heavily in R&D, allowing employees to explore new ideas and push the boundaries of what is possible in the semiconductor industry. This commitment to innovation creates a dynamic and exciting work environment where employees are encouraged to think outside the box and pursue their creative ideas.

Furthermore, American Semiconductor's dedication to providing complete solutions sets them apart from their competitors. From development and integration to pilot production, the company offers a comprehensive range of services that allow customers to bring their products to market quickly and efficiently. This end-to-end approach not only benefits customers but also provides employees with a diverse range of projects and opportunities to expand their skill set.

In terms of facilities, American Semiconductor operates a 9,000 square foot facility in Boise, Idaho. This facility houses the WLCSP fabrication, assembly, and test operations, ensuring that all aspects of the manufacturing process are carried out under one roof. This streamlined approach allows for efficient communication and collaboration between teams, fostering a sense of unity and teamwork among employees.

Moreover, American Semiconductor's recent joint venture with HD MicroSystems in 2019 has further expanded their capabilities. This strategic partnership has allowed the company to enhance their advanced packaging and assembly services, solidifying their position as a leader in the industry. For employees, this joint venture opens up new avenues for growth and development, as they have the opportunity to work on even more complex and challenging projects.

In conclusion, working at American Semiconductor, Inc. is an exciting prospect for employees in the semiconductor industry. With their revolutionary Semiconductor-on-Polymer (SoP) wafer level chip scale packaging (WLCSP) technology, the company is at the forefront of thin device fabrication. The opportunity to work with cutting-edge technology, the commitment to research and development, and the comprehensive range of services offered by American Semiconductor make it an ideal workplace for those seeking to make a real impact in the industry. With their state-of-the-art facility in Boise, Idaho, and their strategic partnerships, American Semiconductor is poised to continue pushing the boundaries of what is possible in the semiconductor industry.